6040-0939 - Heat Sink Thermal Joint Compound
29374 2 oz. tube ("Thermalcote", Thermalloy Inc. part No. 250) https://schema.org/UsedCondition Hewlett-Packard Enterprise (HPE)ASK A QUESTION
Heat Sink Thermal Joint Compound
Item#: 6040-0939
Full Name
Email Address
Phone Number
Preferred Contact Method
Message
About this item
6040-0939 - Heat Sink Thermal Joint Compound is a high-performance thermal paste designed to improve heat transfer between electronic components and heat sinks. Ideal for use in computers, CPUs, GPUs, power transistors, and other electronic devices, this compound fills microscopic air gaps and irregularities, ensuring efficient thermal conductivity. Its easy-to-apply consistency allows for precise application, optimizing cooling and preventing overheating. The 6040-0939 compound ensures reliable, long-lasting performance under varying temperature conditions, making it suitable for both DIY enthusiasts and professionals seeking to maximize hardware longevity and stability. Perfect for maintenance, upgrades, or new builds requiring superior heat dissipation.
Once the user has seen at least one product this snippet will be visible.
Compatible Products
Finding the exact part number for your machine can be challenging due to market limitations or availability issues. Below, you’ll find a carousel of products that are compatible with the item currently being viewed. Each of these products has been carefully vetted to ensure compatibility with your machine. Please note that while we guarantee the compatibility of these items, errors can occasionally occur. If you receive an item that does not work as intended, we will provide you with favorable return instructions to resolve the issue.
Once the user has seen at least one product this snippet will be visible.