664185-001 - Thermal Pad Sodimm, Nisene
615159 https://schema.org/UsedCondition Hewlett-Packard (HP)ASK A QUESTION
Thermal Pad Sodimm, Nisene
Item#: 664185-001
Full Name
Email Address
Phone Number
Preferred Contact Method
Message
About this item
The 664185-001 Thermal Pad SODIMM by Nisene is a replacement thermal interface component designed for compatible computer systems. Positioned around the SODIMM memory area, it helps transfer heat away from the module and surrounding components, supporting more consistent operating temperatures and reliable performance. This pad is useful when an original thermal pad has deteriorated, become compressed, or was removed during servicing. Its purpose-built design helps provide appropriate contact between the memory module and its cooling surface. Ideal for repair, maintenance, or refurbishment applications, this replacement part can help restore proper thermal management when installed according to the system manufacturer’s service instructions and compatibility requirements.
Once the user has seen at least one product this snippet will be visible.
Compatible Products
Finding the exact part number for your machine can be challenging due to market limitations or availability issues. Below, you’ll find a carousel of products that are compatible with the item currently being viewed. Each of these products has been carefully vetted to ensure compatibility with your machine. Please note that while we guarantee the compatibility of these items, errors can occasionally occur. If you receive an item that does not work as intended, we will provide you with favorable return instructions to resolve the issue.
Once the user has seen at least one product this snippet will be visible.